Semiconductor Precision Motion Solutions – Metrology & Advanced Packaging

TGV Drilling Precision Motion System – ±0.1 µm, High Throughput

YiNGUAN’s precision motion system for TGV drilling delivers ±0.1 µm accuracy, high speed/acceleration, multi‑axis control and long‑term stability. Boosts yield and throughput.

TGV drilling glass via precision motion system advanced packaging multi‑axis control

Precision Motion System for Nanoimprint – Sub‑nm Accuracy

YiNGUAN’s nanoimprint motion system features sub‑nm repeatability, active vibration cancellation, thermal drift compensation, and process‑aware control. Boosts throughput, yield and cost efficiency for advanced wafer manufacturing.

nanoimprint lithography precision motion system active vibration suppression AI‑based compensation wafer manufacturing

Precision Motion for Mask Inspection – Sub‑0.05μm Accuracy

Configurable precision stages for mask/reticle inspection: accuracy from ±0.8μm down to ±0.05μm. Supports XY, XYZT or six‑axis. Highly customizable for advanced nodes and vacuum environments.

mask inspection reticle inspection precision motion system semiconductor metrology nanometer accuracy

Advanced Packaging Die Bonder Motion System – High Precision

High-speed, high-accuracy direct-drive motion platform for die bonding. ±0.5μm XY repeatability, ±0.2μm Z accuracy, ±2 arcsec rotation. Supports maglev/water-cooled Z-axis options. Customizable.

die bonder advanced packaging precision motion system flip chip hybrid bonding

Advanced Packaging Wafer Thinning Motion System – ±0.2μm Repeatability

Motion platform for wafer thinning and CMP equipment. Compatible with 6/8/12‑inch wafers. X/Y repeatability ±0.5μm, Z axis ±0.2μm, T axis ±2arcsec. Ideal for TSV, 3D packaging and high‑density advanced packaging applications.

wafer thinning grinding/CMP equipment precision motion system advanced packaging multi‑axis stage

Wafer Dicing Motion System – ±0.5μm XY, ±0.2μm Z Repeatability

High‑speed direct‑drive motion system for blade & laser dicing. XY ±0.5μm, Z ±0.2μm, rotary ±2arcsec repeatability. Porous ceramic chuck, optional maglev/water‑cooled Z‑axis. Customizable for advanced packaging and thin wafer processing.

wafer dicing blade/laser dicing precision direct‑drive motion semiconductor back‑end high‑speed dicing