【Huge Market, Clear Pain Points】
The explosive demand for AI, HPC, and 5G chips is driving the rapid adoption of TGV (Through Glass Via) technology, a cornerstone of advanced packaging! The market for related equipment is projected to reach hundreds of millions of dollars by 2028. However, many current TGV drilling machines suffer from insufficient motion system precision, low efficiency, and poor stability — directly impacting chip yield and production costs.
【Stringent Requirements Imposed by TGV Drilling？】
1.Ultimate Precision（Nanometer Level）： Drilling micron-sized vias in brittle glass — any minute vibration or positioning error can lead to product scrap.
2.Ultra-High Efficiency（High Throughput）： Millions or even tens of millions of holes need to be drilled on a single wafer. The speed and acceleration of the motion system directly determine equipment productivity.
3.Long-Term Stability: Requires long-term continuous stable operation, resisting temperature fluctuations and vibration interference, ensuring yield consistency in mass production.
4.Multi-Axis Coordinated Control: Precision drilling often requires perfect synchronization and coordination of multiple axes (X‑Y‑Z) — trajectory planning capability is crucial.
【The Solution: YiNGUAN Precision Motion System — Born for TGV Drilling!】
Addressing industry pain points head-on, YiNGUAN Semiconductor has launched a high‑performance precision motion system solution specifically for TGV drilling equipment, helping you seize market opportunities!
Core Advantages of YiNGUAN Semiconductor’s TGV Drilling Motion System:
Nanometer‑Level Positioning Accuracy: Utilizes high‑performance linear motors and interferometric grating scale closed‑loop feedback to achieve ultra‑precision positioning of ±0.1 µm or better, ensuring every hole is accurately placed.
Lightning‑Fast Motion Speed: Optimized high‑rigidity structural design and advanced control algorithms deliver excellent motion speed and acceleration without sacrificing precision, dramatically increasing equipment throughput.
Long‑Lasting, Reliable Stability: The system undergoes precise dynamic analysis and thermal management design, offering outstanding vibration resistance and thermal stability — maintaining superior performance even under long‑term, high‑intensity operation.
Intelligent Motion Control Platform: Integrates YiNGUAN Semiconductor’s self‑developed multi‑axis motion controller, supporting complex trajectory interpolation and real‑time error compensation, making intricate multi‑hole array processing simple and reliable.
Choosing YiNGUAN Semiconductor means:
✅ Higher product yield
✅ Faster production cycle
✅ Lower overall cost
✅ Stronger market competitiveness
Take Action Now — Unlock Unlimited Possibilities!
If you are struggling with precision, efficiency, or stability issues in your TGV drilling equipment, YiNGUAN Semiconductor’s tailor‑made solution is exactly what you need.
