Advanced Packaging - Shanghai YiNGUAN Semiconductor Technology Co., LTD

TGV Drilling Precision Motion System – ±0.1 µm, High Throughput

YiNGUAN’s precision motion system for TGV drilling delivers ±0.1 µm accuracy, high speed/acceleration, multi‑axis control and long‑term stability. Boosts yield and throughput.

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Advanced Packaging Die Bonder Motion System – High Precision

High-speed, high-accuracy direct-drive motion platform for die bonding. ±0.5μm XY repeatability, ±0.2μm Z accuracy, ±2 arcsec rotation. Supports maglev/water-cooled Z-axis options. Customizable.

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Advanced Packaging Wafer Thinning Motion System – ±0.2μm Repeatability

Motion platform for wafer thinning and CMP equipment. Compatible with 6/8/12‑inch wafers. X/Y repeatability ±0.5μm, Z axis ±0.2μm, T axis ±2arcsec. Ideal for TSV, 3D packaging and high‑density advanced packaging applications.

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Wafer Dicing Motion System – ±0.5μm XY, ±0.2μm Z Repeatability

High‑speed direct‑drive motion system for blade & laser dicing. XY ±0.5μm, Z ±0.2μm, rotary ±2arcsec repeatability. Porous ceramic chuck, optional maglev/water‑cooled Z‑axis. Customizable for advanced packaging and thin wafer processing.

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Advanced Packaging Hybrid Bonding Equipment Motion System

High‑speed, high‑precision coarse‑fine motion system for W2W/D2W hybrid bonding. Air‑bearing for rapid wafer placement, piezoelectric stage for nm‑level alignment. Custom Z‑axis (maglev/water‑cooled). Boosts yield & throughput.

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