Semiconductor - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Advanced Packaging Hybrid Bonding Equipment Motion System

High‑speed, high‑precision coarse‑fine motion system for W2W/D2W hybrid bonding. Air‑bearing for rapid wafer placement, piezoelectric stage for nm‑level alignment. Custom Z‑axis (maglev/water‑cooled). Boosts yield & throughput.

hybrid bonding advanced packaging precision motion system wafer stacking die bonding

Film Thickness Metrology Motion System – Compact, Maglev Z

Compact motion system for film thickness metrology (ellipsometry/four‑probe). Dual‑axis coupling, maglev Z compensation reduces motor load, boosts performance & lifetime. For integrated/standalone tools. High throughput. Ideal for wafer metrology.

film thickness metrology ellipsometry four‑point probe maglev gravity compensation wafer metrology

Overlay Metrology Motion System – 2nm Static Jitter, 20m/s²

High‑end motion system for overlay metrology (IBO/DBO/SEM‑OL). 2nm static jitter, 20m/s² acceleration. Vibration isolation and vertical piezo stage (2nm) options. For lithography and overlay inspection tools.

overlay metrology high‑dynamic motion stage static jitter vibration isolation piezoelectric vertical stage

E‑beam Inspection Vacuum Stage – ±2nm Stability, <0.1% Speed Variation

High‑vacuum XY stage for E‑beam inspection and CD‑SEM. ±2nm position stability, <0.1% speed variation at 100mm/s. Mass‑produced, running in domestic fabs. Optional ESC, vacuum‑compatible laser interferometers and piezo motors.

E‑beam inspection CD‑SEM vacuum motion system position stability electrostatic chuck