The Electrostatic Chuck (E-Chuck) is a holding tool for substrates such as silicon wafers in semiconductor processes. Based on the principle of electrostatic adsorption, the E-Chuck fixes substrates like silicon wafers through Coulomb force or gradient force generated by the chuck after the application of an external high voltage.
General dimension,Unit:mm
|
|
Unit |
6inch E-Chuck |
8inch E-Chuck |
12inch E-Chuck |
|
Electrostatic type |
|
Coulombic or Gradient |
Coulombic or Gradient |
Coulombic or Gradient |
|
Electrode type |
|
Bi-polar or interdigitated electrode |
||
|
Accuracy |
|
|
|
|
|
Global flatness |
μm |
≤3 |
≤3 | ≤3 |
|
Parallelism |
μm |
＜30 |
＜30 |
＜30 |
|
Electrical properties |
|
|
|
|
|
Standard clamping voltage |
V |
1000 |
1000 |
1000 |
|
Leakage current |
nA |
＜5 |
＜5 |
＜5 |
|
Performance parameter |
|
|
|
|
|
Clamping force |
N |
≥8 (Coulomb) |
≥12(Coulomb) |
≥30(Coulomb) |
|
Dimensions |
|
|
|
|
|
Diameter |
mm |
144 |
194 |
294 |
|
Thickness |
mm |
12.6 |
12.6 |
12.6 |
*Customized requirements accepted
